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Jiangyin Entret Coating Technology Co., Ltd.

Molybdenum, Molybdenum Plate, Molybdenum Target manufacturer / supplier in China, offering Molybdenum Backing Plate for Sputtering Target Bonding, Good Price for Tantalum Sputtering Target of High Quality, Ta Target, High Purity for ZnO Sputtering Target and so on.

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Supplier Homepage Product Metal Sputtering target molybdenum target Molybdenum Backing Plate for Sputtering Target Bonding

Molybdenum Backing Plate for Sputtering Target Bonding

FOB Price: US $10 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $10/ Piece
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Production Capacity: 10000PCS
Transport Package: Standard Packing for Export
Payment Terms: L/C, T/T, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: ETT-Mo12121
  • Standard: ASTM
  • Alloy: Non-alloy
  • Powder: Not Powder
  • Specification: as per the customer′s request
  • HS Code: 90019090
  • Application: Industrial
  • Purity: >99.95%
  • Type: Molybdenum Plate
  • Trademark: Entret
  • Origin: Jiangyin
Product Description
Entret Coating Technology Co.,LTD ,located in the yangtze river delta --Jiangyin ,China,is a professional high-tech company dedicated to manufacturing various sputtering targets and related products .
 
MaterialCompositionPuritySputtering Targets Evaporation
Materials
RotatablePlanar
Agn.a.99.99%  Max.  
Al n.a.99.999% Max
Cun.a.99.999% Max
Crn.a.99.95%  Max.
Hfn.a.99.9% Max.  
Mon.a.99.95%  Max. 
Nin.a.99.995% Max.
Sin.a.99.999% Max 
Snn.a.99.99%  Max. 
Tan.a.99.99%  Max.  
Tin.a.99.995% Max.
Wn.a.99.95%  Max. 
Zrn.a.99.95%  Max. 
CrALCr-70Al .Cr-50Al,Cr-30Al ( at% )99.95%  Max.  
SiAlSi - Al 10,Si-30Al( or customized )99.95%  Max. 
SiZrSi- Zr3099.9% Max.  
TiAlTi-70Al ,Ti-67Al,Ti-50Al,Ti-30Al ( at%)99.95%  Max.  
NiCrNi-20Cr,Ni-50Cr,Ni-70Cr(wt%)99.99%  Max.
NiVNi-V7 (wt%)99.95%  Max. 
SnZnZn50 Sn5099.99%  Max.  
SnAlZn98Al299.9% Max.  
NbOxn.a.99.99%  Max.
TiOxn.a.99.6% Max
AZOAl2O3/( ZnO+ Al2O3) = 2±0.2 wt%99.95%  Max.

Molybdenum Backing Plate for Sputtering Target Bonding

Molybdenum Backing Plate for Sputtering Target Bonding

 
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